HDI-Led High-Complexity PCB Manufacturer
Any-Layer HDI.
Every Difficult Board.
Any-layer HDI to 6th order. Laser vias to 0.07 mm. Megtron 6/7 & Rogers in-stock. We manufacture the PCBs other shops turn away — and we've done it since 2012.
8 PCB Capabilities
HDI leads. Every difficult board follows.
Any-Layer HDI PCB
Stacked & staggered microvias, any-layer interconnect. 6th-order and above, laser vias to 0.07 mm. The board type that defines everything we do.
- 0.07 mm laser via
- Any-layer 6th-order+
- 2.5/2.5 mil line/space
High Layer Count PCB
Sequential lamination up to 36+ layers. Controlled impedance, Megtron 6/7 capable.
- Up to 36+ layers
- Megtron 6/7 / FR-4
- ±8% impedance
RF / High-Frequency PCB
Rogers, PTFE and mixed-dielectric (Rogers+FR-4) stackups for microwave and mmWave designs.
- Rogers / PTFE / hybrid
- ±8% impedance
- 2.5/2.5 mil
High-Speed Digital PCB
Megtron 6/7, S1000-2M and S7136H low-loss laminates in stock for multi-gigabit designs.
- Megtron 6/7 in stock
- ±8% impedance
- Up to 36 layers
Rigid-Flex PCB
HDI rigid-flex, multilayer FPC, air-gap and any-layer structures on adhesiveless PI.
- Up to 30 layers
- Adhesiveless PI
- 8 structures
Heavy Copper PCB
Up to 10 oz+ copper for power electronics, busbars, and high-current power planes.
- ½–10 oz+ copper
- 2–20 layers
- FR-4 / High-Tg
Metal Core / Thermal PCB
Aluminum and copper core MCPCB for LED, power modules and thermal management.
- Al / Cu core
- Heavy copper option
- IPC Class 3
Backplane PCB
Thick, high-layer backplanes — over 20:1 aspect ratio, tight hole registration for connectors.
- Up to 36 layers
- >20:1 aspect ratio
- ±0.025 mm holes
Why Engineers Choose HSX Circuits
We built this factory around HDI. Everything else follows from that decision.
HDI is Our Core
Stacked microvias and sequential lamination are not add-on services — they are the foundation every other capability is built on.
Materials In-Stock
Megtron 6, Rogers 4350B, PTFE, Polyimide — we hold the exotic substrates so you do not wait 4 weeks for material procurement.
DFM on Every HDI Order
Our engineers review every stackup before production starts. We catch microvia aspect ratio and impedance issues before they cost you a respun board.
24-Hour Quote Response
Real engineers review every RFQ. No automated quoting bots, no hidden DFM charges after the fact.
Beyond Standard Limits
Pushing past the datasheet — together
When your design sits beyond standard process windows — extreme aspect ratios, exotic stackups, new materials — we don't just say no. Our process engineers work with your team to evaluate, prototype, and co-develop a manufacturable solution.
Talk to our engineers →Factory Capabilities at a Glance
Industries We Serve
High-complexity PCBs for applications where failure is not an option.
Materials & Finishes
Premium laminates and the full finish range — held in stock for faster turns.
Laminates
Surface Finishes
Quality & Standards
Built and inspected to aerospace-grade acceptance.
Frequently Asked Questions
What's the maximum layer count and HDI capability you offer?
Up to 36 layers and any-layer HDI to 6th order and above, with laser microvias down to 0.07 mm. For higher-order designs we actively co-develop with customers.
Can you make boards that exceed your standard process limits?
Yes — for beyond-spec designs our process engineers evaluate and co-develop a manufacturable solution with your team rather than declining outright.
Do you do RF and high-speed PCBs?
Yes — Megtron 6/7, Rogers, PTFE and mixed-dielectric constructions, with impedance control to ±8% (±5 Ω at ≤50 Ω).
What surface finishes are available?
ENIG, ENEPIG, immersion silver/tin, OSP, HASL, hard gold / gold fingers and full-plate gold.
What quality standard do you build to?
IPC Class 3 / mil-spec acceptance.
Ready to Quote Your Next HDI Board?
Use our instant Capability Checker to verify your specs — then send us your Gerbers. Engineers respond within 24 business hours.