Backplane PCB
A backplane PCB manufacturer for thick, high-layer-count boards — over 20:1 aspect ratio, tight hole registration for connectors, and heavy copper power planes.
Key Capabilities
A backplane is where thickness, layer count and hole accuracy all peak at once. As a backplane PCB manufacturer, we build thick, high-layer-count boards up to 36 layers, with aspect ratios over 20:1 and hole position tolerance of ±0.025 mm — the registration connectors demand. Heavy copper planes (up to 10 oz and beyond on review) carry power across the board, and builds over 6.3 mm thick are routine. Held to IPC Class 3 / mil-spec. Built for low-volume, fast-turn backplane prototypes in telecom, computing and defense.
Technical Specifications
Verified production capability limits. ● = maximum achievable spec.
| Parameter | Value |
|---|---|
| Layer count | Up to 36 layers ● |
| Aspect ratio | Over 20:1 ● |
| Max board thickness | Over 6.3 mm |
| Hole position tolerance | ±0.025 mm ● |
| Heavy copper planes | Up to 10 oz+ (on review) |
| Maximum board size | 580 × 900 mm |
| Press-fit / connector holes | Supported (tolerance confirmed per design) |
| Surface finishes | ENIG, hard gold / gold fingers |
| Acceptance | IPC Class 3 / mil-spec |
Engineering Highlights
- Thick, high-layer builds
Up to 36 layers, over 6.3 mm.
- Over 20:1 aspect ratio
For deep connector holes.
- ±0.025 mm hole position
For reliable press-fit / connectors.
- Heavy copper planes
For backplane power distribution.
Why it's hard
Deep high-aspect drilling, hole registration across a thick stack, and even plating in long holes.
How we build it
High-aspect drilling and plating with tight registration control, to IPC Class 3.
Applications
Telecom and networking chassis, servers and computing, aerospace/defense systems, test and measurement backplanes.
Material Selection
Backplanes start with high-Tg FR-4 and move to low-loss laminates for high-speed links:
- High-Tg: Isola 370HR / IS410, Ventec VT-47, Nelco N4000-13EP.
- High-speed backplane: Megtron 6/7 class and equivalents (see the High-Speed page).
We confirm the exact material and availability with your design.
Design & DFM
- Confirm drilled aspect ratio against board thickness; deep holes need plating validation.
- Plan press-fit hole tolerances with connector-vendor specs.
- Hold registration across the thick stack; reference high-speed links to solid planes.
Proven
Thick high-layer backplanes to IPC Class 3 with tight hole registration.
Beyond the datasheet
For extreme thickness, aspect ratio or connector requirements, our engineers co-develop the build with your team.
Industries We Serve
Frequently Asked Questions
Related Capabilities
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