Rigid-Flex PCB
A rigid-flex PCB manufacturer built for the hardest 3D builds — HDI rigid-flex, multilayer FPC, air-gap and any-layer structures, on adhesiveless PI, in low volume and fast turnaround.
Key Capabilities
Rigid-flex is where the board has to be two things at once — rigid where components mount, flexible where it folds. As a rigid-flex PCB manufacturer, we build HDI rigid-flex and multilayer FPC up to 30 layers, including the structures most fabricators avoid: book-type air-gap, left-right and single-side asymmetric, multi-tail, and high-order any-layer HDI rigid-flex.
We run a full in-house HDI line — CO2 laser drilling, VCP filled-via plating, and LDI imaging — and standardize on adhesiveless PI for better plated-hole quality and bend reliability. Our window-opening (uncovering) process uses controlled-depth laser and mechanical routing to plus-minus 0.05 mm. Laser microvias go to 0.075 mm, with inner-layer lines down to 1.5/2 mil on thin copper, held to IPC Class 2/3.
Built for low-volume, fast-turn rigid-flex prototypes — and for the designs that need engineering, not just fabrication.
Technical Specifications
Verified production capability limits. ● = maximum achievable spec.
| Parameter | Value |
|---|---|
| Layer count | Rigid-flex 2-30 · FPC 1-12 layers ● |
| Structures | 8 types: conventional, asymmetric, book-type air-gap, multi-flex laminated, multi-tail, any-layer HDI rigid-flex |
| HDI rigid-flex | Any-layer interconnect (sample / small-batch for highest order) |
| Flex base material | Adhesiveless PI (standard); coverlay; no-flow PP |
| Min line / space | Inner 1.5/2 mil (0.5 oz) -> 3/3 mil (1 oz); outer from 3/3 mil ● |
| Min finished hole | 0.075 mm (laser) · 0.15 mm (mechanical) ● |
| Window / uncovering | ±0.05 mm ● |
| Aspect ratio | 20:1 |
| Impedance control | ±10% |
| Board thickness | 0.2-7 mm |
| Max size | 2-4L: 480×1100 mm · ≥8L: 580×890 mm |
| Surface finishes | ENIG, immersion tin, immersion silver, OSP, gold finger, selective thick gold |
| Acceptance | IPC Class 2 / Class 3 |
Engineering Highlights
- Full in-house HDI line
Among the first mid-size Shenzhen quick-turn fabs with a complete HDI line — fast HDI rigid-flex delivery.
- Adhesiveless PI standard
Better hole-wall quality and bend reliability than glue-based film.
- 8 rigid-flex structures
Including book-type air-gap and any-layer HDI rigid-flex.
- Controlled-depth uncovering to ±0.05 mm
Clean window opening without damaging the flex.
Why rigid-flex is hard
The window (uncovering) that exposes the flex, controlling resin flow in air-gap structures, and keeping the flex region thin enough to bend reliably — all in one board.
How we build it
Controlled-depth laser and mechanical uncovering to ±0.05 mm, adhesiveless PI, and a full in-house HDI line, to IPC Class 2/3. Our pre-production engineering system standardizes stackup, impedance and DFM so issues are caught before fabrication.
Applications
Wearables and hearables, medical imaging, monitoring and probes, foldable and compact consumer, industrial connectors and sensors, cameras and optical modules.
Material Selection
Rigid-flex centers on the flex base material. We standardize on adhesiveless PI for reliability:
- Adhesiveless vs adhesive PI: higher Tg (280–350 °C vs 60–120 °C), lower Dk (3.0–3.5 vs 4.0–4.3), far better bend life (~1400 vs 300 cycles) and dimensional stability.
- Coverlay (PI) and no-flow PP for flex-to-rigid transitions; rigid cores in standard FR-4 / high-Tg.
We confirm the exact material and availability with your design.
Design & DFM
- Keep the flex region as thin as the bend allows — flex thickness drives bend reliability.
- Use local (not full-board) coverlay where possible to improve interlayer bond and cut cycle time.
- Plan air-gap structures for controlled resin flow during lamination.
- Specify uncovering windows and bend radius early (±0.05 mm uncovering).
Proven
- Wearable camera, 8-layer HDI rigid-flex: an over-thick flex region had stalled the customer for two years. We re-engineered the stackup (merging redundant power layers), cut flex thickness ~20%, and raised assembly yield from 60% to 95%.
- 2-rigid + 8-flex air-gap board that couldn't be electrically tested conventionally: we added a temporary rigid test sub-board (removed after E-test) and controlled resin flow to keep it manufacturable. Co-development, not order-taking.
Beyond the datasheet
Rigid-flex is where engineering wins or loses the board. For designs past standard windows, our engineers re-stack, prototype and co-develop a manufacturable, reliable solution with your team.
Industries We Serve
Frequently Asked Questions
Related Capabilities
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