★ Flagship Product Line
Any-Layer HDI PCB
We're an any-layer HDI PCB manufacturer built for the hard stuff — 6th-order and above stacked-microvia constructions, laser vias down to 0.07 mm, and via-in-pad reliability, in low volume and fast turnaround.
Key Capabilities
Any-layer HDI is where high-density interconnect stops being a feature and becomes the whole board. As an any-layer HDI PCB manufacturer, we build constructions where every layer can carry laser-drilled microvias — stacked or staggered — to route the finest BGA pitches and the densest SoC breakouts.
Our in-house HDI process handles 6th-order build-ups and above, with up to six or more sequential lamination cycles, blind and buried vias, and via-in-pad with filled-and-capped vias for flat, reliable pads. Laser microvias go down to 0.07 mm, with minimum line width and spacing of 2.5/2.5 mil. We run high-speed and RF-grade laminates — Panasonic Megtron 6/7, Rogers, and mixed-dielectric stacks — held to IPC Class 3 / mil-spec acceptance.
We are built for low-volume, fast-turn prototypes and complex small runs — the difficult any-layer HDI work that high-volume houses turn away.
Technical Specifications
Verified production capability limits. ● = maximum achievable spec.
| Parameter | Value |
|---|---|
| HDI build-up (order) | Any-layer, 6th-order and above ● |
| Microvia type | Stacked & staggered |
| Laser microvia diameter | Down to 0.07 mm (70 µm) ● |
| Sequential laminations | 6+ cycles |
| Blind / buried vias | Yes (multi-step) |
| Via fill | Resin / copper filled & capped (via-in-pad) |
| Min line width / space | 2.5 / 2.5 mil ● |
| Aspect ratio | Over 20:1 ● |
| Hole position tolerance | ±0.025 mm |
| Layer count | Up to 36 (pushing higher-order) layers |
| Materials | Megtron 6/7, Rogers, PTFE, mixed-dielectric, high-Tg FR-4 |
| Surface finishes | ENIG, ENEPIG, immersion Ag/Sn, OSP, hard gold |
| Impedance control | ±8% (±5 Ω at ≤50 Ω) |
| Acceptance | IPC Class 3 / mil-spec |
Engineering Highlights
- Any-layer construction
Laser microvias on every layer, stacked or staggered, for maximum routing density.
- 6+ sequential laminations
6th-order and above build-ups for the most demanding stackups.
- Laser microvias to 0.07 mm
Fine-pitch BGA and SoC breakout without compromise.
- Via-in-pad, filled & capped
Flat, void-free pads for reliable assembly.
Why any-layer HDI is hard
Each build-up order adds a lamination, a laser-drill step, and a plating cycle. Registration tightens with every layer, and stacked microvias must be filled flat enough to drill and plate the next. Getting 6th-order and above to yield is a process-control problem, not a spec sheet.
How we build it
Our HDI line runs sequential lamination, laser drilling to 0.07 mm, resin and copper via fill, and fine-line imaging at 2.5/2.5 mil — all in-house, so the hard steps stay under our control. IPC Class 3 / mil-spec, with high-speed and RF laminates including Megtron 6/7 and Rogers.
Applications
Smartphones and mobile, wearables, SoC / FPGA / processor breakout boards, medical imaging and monitoring, aerospace and defense modules, and high-density RF and baseband.
Material Selection
Any-layer HDI runs on high-Tg FR-4 for general builds, and on low-loss or RF laminates (Panasonic Megtron 6/7, Rogers) when the HDI also carries high-speed or RF signals. We hold the registration and via-fill process control thin HDI dielectrics demand. We confirm the exact material and availability with your design.
Design & DFM
- Prefer staggered microvias where density allows; minimize consecutively stacked vias to protect thermal-cycling reliability.
- Reserve via-in-pad (filled & capped) for the densest BGAs.
- Keep the stackup symmetric to control warpage; reference high-speed signals to solid planes.
- Send target impedances early — dielectric height and line width are set in the stackup.
Proven
On an HDI rigid-flex board for a wearable camera, an over-thick flex region had stalled the customer for two years; our engineers re-engineered the any-layer stackup and lifted assembly yield from 60% to 95%. HDI is an engineering problem, not just fabrication.
Beyond the datasheet
When your any-layer HDI design pushes past standard windows — extreme orders, exotic stackups, new materials — we don't decline. Our process engineers evaluate, prototype and co-develop a manufacturable solution with your team.
Industries We Serve
Frequently Asked Questions
Related Capabilities
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