Avionics, radar, guidance and SATCOM hardware demand PCBs that survive vibration, thermal cycling and decades of service. We build any-layer HDI, RF and high-layer-count boards to IPC Class 3 / mil-spec with full material traceability.
Built for aerospace reliability
Aerospace programs run on long lifecycles and zero-defect expectations. Our any-layer HDI process supports dense signal-processor BGA escape, while controlled-impedance RF stackups (Rogers, PTFE) serve radar and SATCOM front-ends.
- IPC Class 3 / mil-spec acceptance
- Full material traceability and CoC documentation
- Mixed-dielectric stackups (FR-4 + Rogers) for RF/digital integration
Relevant Capabilities
The product lines we most often build for aerospace programs.
Any-Layer HDI PCB
Stacked microvias, any-layer interconnect, laser via to 0.07 mm.
View capability →High Layer Count PCB
Up to 36 layers, over 20:1 aspect ratio.
View capability →RF / High-Frequency PCB
Rogers, PTFE and mixed-dielectric stackups.
View capability →High-Speed Digital PCB
Megtron 6/7 low-loss, impedance to plus-minus 8%.
View capability →Backplane PCB
Thick, high-layer, tight hole registration.
View capability →