5G radios, optical transport and core routers depend on dense HDI line cards, low-loss RF front-ends and high-layer backplanes. We build all three to IPC Class 3.
Infrastructure-grade PCB
- High-layer backplanes with tight hole registration (±0.025 mm)
- Rogers / PTFE / mixed-dielectric RF stackups for 5G and mmWave
- Any-layer HDI for optical-module and line-card density
Relevant Capabilities
The product lines we most often build for telecom & 5g programs.
RF / High-Frequency PCB
Rogers, PTFE and mixed-dielectric stackups.
View capability →High-Speed Digital PCB
Megtron 6/7 low-loss, impedance to plus-minus 8%.
View capability →High Layer Count PCB
Up to 36 layers, over 20:1 aspect ratio.
View capability →Backplane PCB
Thick, high-layer, tight hole registration.
View capability →Any-Layer HDI PCB
Stacked microvias, any-layer interconnect, laser via to 0.07 mm.
View capability →