HSX Circuits Expands Any-Layer HDI Production Capacity
New laser-drilling and sequential-lamination capacity shortens lead times for any-layer HDI and high-layer-count orders.
New laser-drilling and sequential-lamination capacity shortens lead times for any-layer HDI and high-layer-count orders.
Our quality processes follow AS9100 discipline with full material traceability for aerospace and defense programs.
We now stock Megtron 6, Rogers 4350B, RO3003 and PTFE laminates so high-speed and RF prototypes are not delayed by material procurement.