High-Speed Digital PCB
A high-speed PCB manufacturer with Megtron 6/7 and low-loss laminates in stock — low Dk/Df materials, controlled impedance, and tight stackups for multi-gigabit designs.
Key Capabilities
Signal integrity starts with low-loss material and ends with controlled impedance. As a high-speed PCB manufacturer, we keep Panasonic Megtron 6/7 in stock alongside low-loss laminates like S1000-2M and S7136H, so multi-gigabit designs don't wait on material lead time. We hold impedance to ±8% (±5 Ω at ≤50 Ω), route at 2.5/2.5 mil, and build mixed-dielectric stacks up to 36 layers, all to IPC Class 3. Low Dk/Df where it counts, FR-4 where it doesn't. Built for low-volume, fast-turn high-speed prototypes and complex small runs.
Technical Specifications
Verified production capability limits. ● = maximum achievable spec.
| Parameter | Value |
|---|---|
| Low-loss laminates | Megtron 6/7, S1000-2M, S7136H |
| Material availability | Megtron 6 in stock |
| Impedance control | ±8% (±5 Ω at ≤50 Ω) ● |
| Min line width / space | 2.5 / 2.5 mil ● |
| Hybrid / mixed-dielectric | Supported |
| Layer count | Up to 36 layers |
| Surface finishes | ENIG, ENEPIG, immersion silver |
| Acceptance | IPC Class 3 / mil-spec |
Engineering Highlights
- Megtron 6/7 in stock
No material lead-time on flagship low-loss builds.
- Controlled impedance to ±8%
For clean multi-gigabit links.
- Low Dk/Df laminates
Megtron, S1000-2M, S7136H.
- Mixed-dielectric stackups
Low-loss where it matters.
Why it's hard
Loss budgets, impedance control and material consistency across a tall stack.
How we build it
Low-loss laminates in stock, controlled-impedance routing, and tight process control to IPC Class 3, coupon-verified.
Applications
Data center and AI servers (PAM4, 112 G), switches and routers, networking line cards, high-speed backplanes, FPGA/ASIC boards, and optical transport.
Material Selection
Match the laminate to your data rate. As an industry guide (we confirm exact material and availability with your design):
| Data rate | Recommended laminates |
|---|---|
| ≤10 Gbps | Isola FR408HR · Shengyi S1000-2M · TUC TU872 (cost-first) |
| 10–25 Gbps | Panasonic Megtron 6 · TUC TU862 · ITEQ IT-988G · Shengyi S6G (mainstream) |
| 25–56 Gbps (PAM4) | Panasonic Megtron 7 · Isola Tachyon 100G · TUC TU883 · Shengyi S7439 (ultra-low loss) |
| 56–112 Gbps+ | Panasonic Megtron 8 · Rogers RO4003C · AGC TSM-DS3 (flagship / AI server) |
Reference Df @10 GHz: Megtron 6 ~0.002, Megtron 7 ~0.0015, Megtron 8 ~0.001, TU883 ~0.002, S7439 ~0.0018, Tachyon ~0.002. Use low-profile copper and glass-weave management to control skew.
Design & DFM
- Define loss budget and target impedances up front; we tune line widths to hit them.
- Reference high-speed pairs to solid planes; keep differential pairs coupled and length-matched.
- Consider back-drilling for stub removal on tall stacks (confirm capability for your build).
- Use LP/VLP copper and spread glass to limit loss and skew.
Proven
Multi-gigabit builds on Megtron-class laminates, impedance-verified with coupons.
Beyond the datasheet
For aggressive loss budgets, new materials or 112 G+ stackups, our engineers co-develop the build with your SI team.
Material by Data Rate
Match the laminate to the link rate; Megtron 6 is held in stock.
Industries We Serve
Frequently Asked Questions
Related Capabilities
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