Heavy Copper PCB

A heavy copper PCB manufacturer for power electronics — up to 10 oz and beyond, hole copper over 50 µm, and high-current builds that carry real load.

Heavy power plane · 10 oz+ copper Fine control traces Hole copper >50 µm
Heavy Copper PCB — signature cross-section

Key Capabilities

6–10 oz standard · 10 oz+ on review Base copper weight
Over 50 µm Hole copper
Over 6.3 mm Max board thickness
Supported Power + control mix
High-Tg FR-4 Materials
IPC Class 3 Acceptance

Power boards live or die on copper. As a heavy copper PCB manufacturer, we build 6–10 oz copper as standard heavy work and go beyond 10 oz on review, with hole copper over 50 µm for high-current vias. We combine heavy power planes with finer control layers in one board, on high-Tg material, held to IPC Class 3. Thick builds over 6.3 mm and busbar-style geometries are routine. Built for low-volume, fast-turn power and industrial prototypes where current density and thermal headroom matter.

Technical Specifications

Verified production capability limits. = maximum achievable spec.

ParameterValue
Base copper weight 6–10 oz (standard) · over 10 oz (on review)
Hole copper thickness Over 50 µm
Power + control mixed build Supported
Max board thickness Over 6.3 mm
Materials High-Tg FR-4
Surface finishes ENIG, HASL, OSP
Acceptance IPC Class 3 / mil-spec

Engineering Highlights

  • 6–10 oz standard, 10 oz+ on review

    For high-current paths.

  • Hole copper over 50 µm

    For robust power vias.

  • Mixed heavy + fine

    Power planes and control traces in one board.

  • Thick builds over 6.3 mm

    And busbar geometries.

Why it's hard

Etching tall copper while holding line geometry, and plating heavy hole copper evenly.

How we build it

Heavy-copper etch and plate processes tuned for power work, to IPC Class 3.

Applications

Power electronics and converters, EV and battery (BMS, busbars), motor drives, industrial power and instrumentation, high-current connectors.

Material Selection

Heavy copper runs on high-Tg, thermally robust FR-4; we move to higher-Tg or specialty laminates for high-temperature power work:

  • Isola 370HR / IS410, Ventec VT-47/57 (Tg 180–190 °C) for high-heat power and automotive.
  • Domestic high-Tg equivalents (Shengyi) as a certified second source.

We confirm the exact material and availability with your design.

Design & DFM

  • Account for trace-width growth in heavy copper etch; send current and temperature-rise targets.
  • Combine heavy planes with fine control layers thoughtfully — different etch needs in one board.
  • Plan thermal relief and via arrays for current transfer.

Proven

Heavy copper power builds to IPC Class 3.

Beyond the datasheet

For copper weights past 10 oz or extreme current density, our engineers co-develop the build with your power team.

Industries We Serve

Frequently Asked Questions

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