New laser-drilling and sequential-lamination capacity shortens lead times for any-layer HDI and high-layer-count orders.
HSX Circuits has expanded its any-layer HDI production line with additional laser-drilling and sequential-lamination capacity. The investment shortens lead times for high-density interconnect and high-layer-count orders, reinforcing our position as an HDI-led high-complexity PCB manufacturer.
The added capacity supports growing demand from telecommunications, high-speed computing and aerospace customers for boards with stacked microvias, 40+ layers and tight impedance control.